We are proud to announce that Snapdec has been selected as a Tech Solution Provider (TSP) under the SmartMFG+ Incentive Programme — a national initiative by the Ministry of Investment, Trade and Industry (MITI) and the Malaysia Digital Economy Corporation (MDEC) to accelerate the digital transformation of Malaysia’s manufacturing sector under the New Industrial Master Plan 2030 (NIMP 2030).
Snapdec joins an inaugural cohort of just 12 homegrown Tech Solution Providers, unveiled at the Malaysia Smart Manufacturing Awards (MSMA) 2025. The programme empowers Malaysia Digital (MD) status companies to build and scale impactful digital solutions for local manufacturers — and Snapdec was recognised for its AI-powered warehouse and manufacturing platforms.
Our heartfelt thanks to MITI and MDEC for trusting Snapdec to contribute to Malaysia’s industrial digitalisation. This recognition strengthens our commitment to building world-class, Malaysian-made systems — and to walking alongside local manufacturers on their journey toward Industry 4.0.
To every customer, partner and team member who brought us here: this milestone is yours too.
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